2.5D interposer is also a 3D WLP that interconnects die side-side on a silicon, glass or organic interposer using TSVs and RDL. In all types of 3D Packaging, chips in the package communicate using off-chip signaling, much as if they were mounted in separate packages on a normal circuit board.
3D ICs can be divided into 3D Stacked ICs (3D SIC), which refers to stacking IC chips using TSV interconnects, and monolithic 3D ICs, which use fab processes to realize 3D interconnects at the local levels of the on-chip wiring hierarchy as set forth by the ITRS, this results in direct vertical interconnects between device layers.
The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.
In terms of Technology, the market is categorised into 3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP).
Depending on Application, the market is classified into MEMS/Sensors, logic, imaging & optoelectronics, power, analog & mixed signal, RF, photonics, memory and LED.
The 3D IC & 2.5D IC Packaging market was valued at xx Million US$ in 2018 and is projected to reach xx Million US$ by 2025, at a CAGR of xx% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for 3D IC & 2.5D IC Packaging.
This report presents the worldwide 3D IC & 2.5D IC Packaging market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
The following manufacturers are covered in this report:
Taiwan Semiconductor Manufacturing
Advanced Semiconductor Engineering
3D IC & 2.5D IC Packaging Breakdown Data by Type
2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
3D IC & 2.5D IC Packaging Breakdown Data by Application
Military & aerospace
Industrial sector and smart technologies
3D IC & 2.5D IC Packaging Production by Region
3D IC & 2.5D IC Packaging Consumption by Region
Rest of Europe
Central & South America
Rest of South America
Middle East & Africa
Rest of Middle East & Africa
The study objectives are:
To analyze and research the global 3D IC & 2.5D IC Packaging status and future forecast，involving, production, revenue, consumption, historical and forecast.
To present the key 3D IC & 2.5D IC Packaging manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
In this study, the years considered to estimate the market size of 3D IC & 2.5D IC Packaging :
History Year: 2014 - 2018
Base Year: 2018
Estimated Year: 2019
Forecast Year: 2019 - 2025
This report includes the estimation of market size for value (million USD) and volume (K Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of 3D IC & 2.5D IC Packaging market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.