Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called "Thermo Compression Bonding". The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.
Thermo Compression Bonding (TCB) is a chip attach technology under investigation and implementation in multiple platforms. The global Thermo Compression Bonder market is driven by increased Thermo Compression Bonder usage: memory applications currently, logic devices next. Meanwhile, Thermo Compression Bonder is gaining market share from wire bond assembly processes. Also, lower throughput coupled with higher processing costs was example of challenges in the TCB technology.
China Thermo Compression Bonder market is valued at $6.39 million in 2017 and is expected to reach $19.53 million by the end of 2023, growing at a CAGR of 20.47% between 2018 and 2023.
The Thermo Compression Bonder market was valued at 33 Million US$ in 2018 and is projected to reach 150 Million US$ by 2025, at a CAGR of 21.0% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Thermo Compression Bonder.
This report presents the worldwide Thermo Compression Bonder market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
The following manufacturers are covered in this report:
Thermo Compression Bonder Breakdown Data by Type
Automatic Thermo Compression Bonder
Manual Thermo Compression Bonder
Thermo Compression Bonder Breakdown Data by Application
Thermo Compression Bonder Production by Region
Thermo Compression Bonder Consumption by Region
Rest of Europe
Central & South America
Rest of South America
Middle East & Africa
Rest of Middle East & Africa
The study objectives are:
To analyze and research the global Thermo Compression Bonder status and future forecast，involving, production, revenue, consumption, historical and forecast.
To present the key Thermo Compression Bonder manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
In this study, the years considered to estimate the market size of Thermo Compression Bonder :
History Year: 2014 - 2018
Base Year: 2018
Estimated Year: 2019
Forecast Year: 2019 - 2025
This report includes the estimation of market size for value (million USD) and volume (Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of Thermo Compression Bonder market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.